Patent Assignment
Reel/Frame 064715/0468
Assignment of Assignor's Interest
Recorded: 2023-08-27
Pages: 4
Assignors
WANG, TAI-JUI
Executed: 2023-08-02
YANG, JUI-WEN
Executed: 2023-08-02
FENG, CHIEH-WEI
Executed: 2023-08-02
LU, CHIH WEI
Executed: 2023-08-02
CHIU, HSIEN-WEI
Executed: 2023-08-02
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 310401, TAIWAN
Covered Property
(1)
Stacked Wiring Structure Having First and Second Wiring Substrate Electrically Connected by First and Second Conductive Through Vias
Application:
18/452,566 →
Publication:
US 2024/0088004