Patent Assignment
Reel/Frame 064739/0760
Assignment of Assignor's Interest
Recorded: 2023-08-29
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
3D-Stacked Semiconductor Device Including Source/Drain Regions Vertically Isolated from Each Other by Strengthened Isolation Structure
Application:
18/239,552 →
Publication:
US 2024/0379780