Patent Assignment
Reel/Frame 064754/0639
Assignment of Assignor's Interest
Recorded: 2023-08-30
Pages: 7
Assignors
AHN, JAEHYUNG
Executed: 2023-07-26
PARK, INSEOK
Executed: 2023-07-26
SONG, JOONSEO
Executed: 2023-07-26
KIM, SOUK
Executed: 2023-07-26
SOHN, YOUNGHOON
Executed: 2023-07-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Measurement Apparatus and Operating Method Thereof
Application:
18/458,565 →
Publication:
US 2024/0248051