Patent Assignment
Reel/Frame 064759/0846
Assignment of Assignor's Interest
Recorded: 2023-08-31
Pages: 3
Assignors
LI, YUHONG
Executed: 2023-08-15
XIAO, HAOYANG
Executed: 2023-08-15
GAO, CHENSHAN
Executed: 2023-08-15
SONG, GUANQIANG
Executed: 2023-08-15
JIANG, JING
Executed: 2023-08-15
Assignee
SKY CHIP INTERCONNECTION TECHNOLOGY CO.,LTD.
101, NO.3, HUAN PING ROAD, GAO QIAO INDUSTRIAL PARK, PINGDI STREET, LONG GANG DISTRICT, SHENZHEN, CHINA
Covered Property
(1)
Packaging Method and Package Member
Application:
18/459,043 →
Publication:
US 2024/0021555