Patent Assignment
Reel/Frame 064771/0784
Assignment of Assignor's Interest
Recorded: 2023-09-01
Pages: 4
Assignor
KIM, JINBUM
Executed: 2023-07-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Comprising a Lower Structure, a Barrier Layer, and an Upper Structure
Application:
18/458,447 →
Publication:
US 2024/0266350