Patent Assignment
Reel/Frame 064777/0455
Assignment of Assignor's Interest
Recorded: 2023-09-01
Pages: 3
Assignors
HUANG, CHUN-HSI
Executed: 2019-04-09
HSUEH, CHIA-LIN
Executed: 2019-04-10
KO, HUANG-CHU
Executed: 2019-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chemical Mechanical Polishing Apparatus and Method