Patent Assignment
Reel/Frame 064787/0679
Assignment of Assignor's Interest
Recorded: 2023-09-05
Pages: 4
Assignors
EJIRI, YOSHINORI
Executed: 2023-08-24
SUKATA, SHINICHIROU
Executed: 2023-08-24
AKAI, KUNIHIKO
Executed: 2023-08-24
SAKAMOTO, MASUMI
Executed: 2023-08-24
SHIMIZU, CHIAKI
Executed: 2023-08-25
KAKEHATA, JUNICHI
Executed: 2023-08-25
YOSHIBA, AYUMI
Executed: 2023-08-25
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Solder Paste, Method for Forming Solder Bumps, and Method for Producing Member with Solder Bumps
Application:
18/263,711 →
Publication:
US 2024/0105653
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.