Patent Assignment
Reel/Frame 064793/0446
Assignment of Assignor's Interest
Recorded: 2023-09-05
Pages: 4
Assignees
ND-HI TECHNOLOGIES LAB, INC.
2F., NO. 22, LN. 35, JIHU RD., NEIHU DIST., TAIPEI CITY, 114754, TAIWAN
ETRON TECHNOLOGY, INC.
NO. 6, TECHNOLOGY ROAD 5, HSINCHU, 300, TAIWAN
Covered Property
(1)
Die Package Including a Semiconductor Die Having a Cavity Within Which a Passive Component Is Positioned, Ic Package and Manufacturing Process Thereof
Application:
17/954,837 →
Publication:
US 2023/0317693