Assignment of Assignor's Interest

Recorded: 2023-09-05 Pages: 4

Assignor

KAWABATA, YASUNORI

Executed: 2023-05-08

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN

Covered Property (1)

Polyimide Precursor, Polyimide, and Flexible Printed Circuit Board

Application: 18/035,607 →

Publication: US 2023/0391955

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.