Patent Assignment
Reel/Frame 064796/0278
Assignment of Assignor's Interest
Recorded: 2023-09-05
Pages: 4
Assignors
LIEN, KANG-YI
Executed: 2022-03-13
TSAI, KUAN-CHI
Executed: 2022-03-14
HUANG, YI-CHIEH
Executed: 2022-03-13
CHEN, HSIANG-FU
Executed: 2022-03-13
HUNG, CHIA-MING
Executed: 2022-03-13
CHIU, I-HSUAN
Executed: 2022-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bond Wave Optimization Method and Device