Patent Assignment
Reel/Frame 064798/0163
Assignment of Assignor's Interest
Recorded: 2023-09-05
Pages: 3
Assignors
AHN, JOSEPH
Executed: 2023-08-30
KOO, KYUNGHA
Executed: 2023-08-30
MOON, HONGKI
Executed: 2023-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Comprising Thermal Management Chamber Using Boiling
Application:
18/461,141 →
Publication:
US 2023/0413484