Patent Assignment
Reel/Frame 064826/0476
Assignment of Assignor's Interest
Recorded: 2023-09-07
Pages: 7
Assignors
KIM, SAMKI
Executed: 2023-07-24
KIM, NAMBIN
Executed: 2023-07-24
KIM, TAEHUN
Executed: 2023-07-24
LIM, SUHWAN
Executed: 2023-07-31
CHOI, HYEONGWON
Executed: 2023-07-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Bonding Type Vertical Semiconductor Devices
Application:
18/243,200 →
Publication:
US 2024/0121958