Patent Assignment
Reel/Frame 064851/0779
Assignment of Assignor's Interest
Recorded: 2023-09-08
Pages: 6
Assignors
JEON, GWANGJAE
Executed: 2023-07-25
KIM, MINKI
Executed: 2023-07-31
SHIN, HYUNGCHUL
Executed: 2023-07-31
LEE, WON IL
Executed: 2023-07-27
LEE, HYUEKJAE
Executed: 2023-07-27
JO, ENBIN
Executed: 2023-07-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Dummy Pads
Application:
18/234,529 →
Publication:
US 2024/0234349