Assignment of Assignor's Interest

Recorded: 2023-09-12 Pages: 6

Assignors

MATSUBARA, HIROAKI

Executed: 2023-08-27

IKEDA, DAISUKE

Executed: 2023-08-25

SOBUE, SHOGO

Executed: 2023-08-23

OGAWA, SAEKO

Executed: 2023-08-21

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Method for Manufacturing Semiconductor Device

Application: 18/548,351 →

Publication: US 2024/0145256

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.