Assignment of Assignor's Interest

Recorded: 2023-09-15 Pages: 7

Assignors

KIM, CHEOL

Executed: 2023-07-24

CHOI, HWANYOUNG

Executed: 2023-07-26

LEE, SEOKHYUN

Executed: 2023-07-26

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO,, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Package and Method of Manufacturing the Semiconductor Package

Application: 18/367,896 →

Publication: US 2024/0120263