Patent Assignment
Reel/Frame 064931/0837
Assignment of Assignor's Interest
Recorded: 2023-09-18
Pages: 4
Assignors
CHANG, JUI SHEN
Executed: 2023-08-31
LAI, YU-CHANG
Executed: 2023-09-17
CHIU, CHEN-NAN
Executed: 2023-09-03
CHUANG, YAO-CHUN
Executed: 2023-09-10
HE, JUN
Executed: 2023-09-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
Application:
18/466,153 →
Publication:
US 2024/0395750