Patent Assignment
Reel/Frame 064949/0544
Assignment of Assignor's Interest
Recorded: 2023-09-19
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional (3D) Semiconductor Memory Device, Method of Manufacturing the Same, and Electronic System Including the Same
Application:
18/469,705 →
Publication:
US 2024/0324205