Assignment of Assignor's Interest

Recorded: 2023-09-19 Pages: 14

Assignors

HIROTANI, HIROSHI

Executed: 2023-07-21

TAKAHASHI, AKIRA

Executed: 2023-07-21

SAITO, TAKUYA

Executed: 2023-07-21

Assignee

KOKUSAI ELECTRIC CORPORATION

3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN

Covered Property (1)

Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium

Application: 18/469,698 →

Publication: US 2024/0006200