Patent Assignment
Reel/Frame 064952/0391
Assignment of Assignor's Interest
Recorded: 2023-09-19
Pages: 8
Assignors
CHAN, BOON TEIK
Executed: 2020-07-24
TAO, ZHENG
Executed: 2021-02-04
ALTAMIRANO SANCHEZ, EFRAIN
Executed: 2021-02-01
GUPTA, ANSHUL
Executed: 2021-02-01
BRIGGS, BASOENE
Executed: 2021-02-03
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Forming a Buried Metal Line in a Semiconductor Substrate