Patent Assignment
Reel/Frame 064976/0719
Assignment of Assignor's Interest
Recorded: 2023-09-20
Pages: 4
Assignors
HSIEH, PING-YIN
Executed: 2023-09-17
CHEN, CHIH-HAO
Executed: 2023-09-17
CHENG, LI-HUI
Executed: 2023-09-17
SHIH, YING-CHING
Executed: 2023-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Package Structure Including a Package Lid Having a Plurality of Fins and Methods of Forming the Same
Application:
18/471,233 →
Publication:
US 2025/0096062