Assignment of Assignor's Interest

Recorded: 2023-09-25 Pages: 4

Assignors

TANAKA, KENSHO

Executed: 2023-09-06

KINDAICHI, RIMPEI

Executed: 2023-09-06

OHUCHI, MARIE

Executed: 2023-09-06

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,, TOKYO, 105-8518, JAPAN

Covered Property (1)

Sic Epitaxial Wafer and Method for Manufacturing Sic Epitaxial Wafer

Application: 18/367,753 →

Publication: US 2024/0093405

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.