Patent Assignment
Reel/Frame 065022/0592
Assignment of Assignor's Interest
Recorded: 2023-09-25
Pages: 37
Assignors
HARADA, KAZUHIRO
Executed: 2021-08-06
MINAMI, MASAYOSHI
Executed: 2021-08-02
KOGURA, SHINTARO
Executed: 2021-07-30
OTANI, SHOGO
Executed: 2021-08-07
HASHIMOTO, YOSHITOMO
Executed: 2021-07-30
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus, and Recording Medium