Assignment of Assignor's Interest

Recorded: 2023-09-26 Pages: 2

Assignors

SHIBATA, TOMOAKI

Executed: 2023-09-21

FUKUZUMI, SHIZU

Executed: 2023-09-21

SHIRASAKA, TOSHIAKI

Executed: 2023-09-21

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Semiconductor Device Manufacturing Method, Semiconductor Device, Integrated Circuit Element, and Integrated Circuit Element Manufacturing Method

Application: 18/552,220 →

Publication: US 2024/0170447

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.