Patent Assignment
Reel/Frame 065024/0147
Assignment of Assignor's Interest
Recorded: 2023-09-26
Pages: 2
Assignors
FUKUZUMI, SHIZU
Executed: 2023-09-21
SHIBATA, TOMOAKI
Executed: 2023-09-21
SHIRASAKA, TOSHIAKI
Executed: 2023-09-21
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device, Semiconductor Device, Integrated Circuit Element, and Method for Manufacturing Integrated Circuit Element
Application:
18/552,222 →
Publication:
US 2024/0170475
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.