Patent Assignment
Reel/Frame 065024/0991
Assignment of Assignor's Interest
Recorded: 2023-09-26
Pages: 7
Assignors
SHIN, SEUNGMIN
Executed: 2023-07-23
PARK, SANGJUN
Executed: 2023-07-13
AN, SUNGJOO
Executed: 2023-07-13
PARK, KIJONG
Executed: 2023-07-13
YOON, ILYOUNG
Executed: 2023-07-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device and Method of Manufacturing the Same
Application:
18/474,394 →
Publication:
US 2024/0251544
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.