Patent Assignment
Reel/Frame 065034/0379
Assignment of Assignor's Interest
Recorded: 2023-09-26
Pages: 7
Assignors
JEON, HYUN JOO
Executed: 2023-09-11
CHOI, JIN HYUK
Executed: 2023-09-11
LEE, KYU SANG
Executed: 2023-09-11
SONG, MYUNG KI
Executed: 2023-09-11
UH, JI HO
Executed: 2023-09-11
LEE, KONG WOO
Executed: 2023-09-11
CHUN, HYUN SOO
Executed: 2023-09-11
HWANG, BEOM SOO
Executed: 2023-09-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Transfer Apparatus, Wafer Transfer System, and Method for Removing Particles in Wafer Transfer Apparatus