Patent Assignment
Reel/Frame 065035/0487
Assignment of Assignor's Interest
Recorded: 2023-09-26
Pages: 10
Assignors
SONG, SEUNG MIN
Executed: 2023-08-11
PARK, PANJAE
Executed: 2023-07-26
SEO, KANG-ILL
Executed: 2023-07-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO,, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Extended Backside Contact Structure
Application:
18/373,058 →
Publication:
US 2024/0290853