Patent Assignment
Reel/Frame 065054/0412
Assignment of Assignor's Interest
Recorded: 2023-09-27
Pages: 3
Assignors
JEON, JINHWAN
Executed: 2023-06-07
JUNG, KWANGHO
Executed: 2023-06-07
CHO, CHIHYUN
Executed: 2023-06-07
HA, SANGWON
Executed: 2023-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Circuit Board Module and Electronic Device Including the Same
Application:
18/373,776 →
Publication:
US 2024/0098912