IP Library Assignment 065064/0570
Patent Assignment
Reel/Frame 065064/0570

Assignment of Assignor's Interest

Recorded: 2023-09-28 Pages: 8
Assignors
TATEOKA, AYUMU
Executed: 2023-08-04
KATO, TSUBASA
Executed: 2023-08-07
KAWAGUCHI, SHOTA
Executed: 2023-08-07
YANG, PO CHUN
Executed: 2023-08-04
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property (1)
Roughened Copper Foil, Copper-Clad Laminate and Printed Wiring Board
Application: 18/284,630 →
Publication: US 2024/0175162
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 31, 2026
From: MITSUI MINING AND SMELTING COMPANY, LIMITED
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 075357/0342 →