Patent Assignment
Reel/Frame 065064/0745
Assignment of Assignor's Interest
Recorded: 2023-09-28
Pages: 7
Assignors
KITABATAKE, YUKIKO
Executed: 2023-08-10
KOMIYA, MIKIKO
Executed: 2023-08-10
MATSUURA, YOSHINORI
Executed: 2023-08-10
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Multilayer Substrate Manufacturing Method and Wiring Substrate
Application:
18/284,643 →
Publication:
US 2024/0196530
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.