Patent Assignment
Reel/Frame 065065/0429
Assignment of Assignor's Interest
Recorded: 2023-09-28
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Heat Dissipation Structure