Assignment of Assignor's Interest

Recorded: 2023-09-29 Pages: 2

Assignors

NOMOTO, SHUJI

Executed: 2023-09-13

SAWAMOTO, HAYATO

Executed: 2023-09-13

YAMASHITA, NAOKI

Executed: 2023-09-14

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Photosensitive Resin Composition, Photosensitive Element, Printed Wiring Board, and Method for Manufacturing Printed Wiring Board

Application: 18/550,826 →

Publication: US 2024/0160103

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.