Patent Assignment
Reel/Frame 065078/0065
Assignment of Assignor's Interest
Recorded: 2023-09-29
Pages: 2
Assignee
WINBOND ELECTRONICS CORP.
NO.8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Method for Reducing Wafer Edge Defects
Application:
18/476,987 →
Publication:
US 2025/0054807