Patent Assignment
Reel/Frame 065080/0577
Assignment of Assignor's Interest
Recorded: 2023-09-30
Pages: 6
Assignors
PAN, CHEN-WEI
Executed: 2021-01-27
HSUEH, JEN-CHIH
Executed: 2021-01-22
CHU, LI-FENG
Executed: 2021-01-27
LIAO, CHIH-TENG
Executed: 2021-01-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
Application:
18/231,433 →
Publication:
US 2023/0378327