Patent Assignment
Reel/Frame 065088/0728
Assignment of Assignor's Interest
Recorded: 2023-10-02
Pages: 5
Assignors
SEKIYA, KAZUMA
Executed: 2023-09-27
HIRATA, KAZUYA
Executed: 2023-09-27
IGA, HAYATO
Executed: 2023-09-27
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Processing Method of Bonded Wafer