Patent Assignment
Reel/Frame 065112/0862
Assignment of Assignor's Interest
Recorded: 2023-10-03
Pages: 5
Assignors
WENG, CHUNG-MING
Executed: 2023-09-25
CHEN, YU-HAO
Executed: 2023-09-25
TSAI, HAO-YI
Executed: 2023-09-25
SU, AN-JHIH
Executed: 2023-09-25
LIU, TZUAN-HORNG
Executed: 2023-09-26
TENG, PO-YUAN
Executed: 2023-09-26
YU, TSUNG-YUAN
Executed: 2023-09-25
HSU, CHE-HSIANG
Executed: 2023-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same