Patent Assignment
Reel/Frame 065130/0414
Assignment of Assignor's Interest
Recorded: 2023-10-05
Pages: 4
Assignors
HSU, CHUNG-WEI
Executed: 2021-01-27
CHIANG, KUO-CHENG
Executed: 2021-01-27
HUANG, MAO-LIN
Executed: 2021-01-27
CHU, LUNG-KUN
Executed: 2021-01-27
YU, JIA-NI
Executed: 2021-01-27
CHENG, KUAN-LUN
Executed: 2021-01-27
WANG, CHIH-HAO
Executed: 2021-01-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structures and Methods Thereof