Patent Assignment
Reel/Frame 065159/0665
Assignment of Assignor's Interest
Recorded: 2023-10-09
Pages: 3
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Direct Hybrid Bond Pad Having Tapered Sidewall
Application:
18/319,786 →
Publication:
US 2024/0387419