Patent Assignment
Reel/Frame 065160/0466
Assignment of Assignor's Interest
Recorded: 2023-10-09
Pages: 4
Assignors
JUNG, HOE CHUL
Executed: 2023-09-18
KANG, YUN SUNG
Executed: 2023-09-18
KIM, SUN HWA
Executed: 2023-09-18
PARK, BYEONG GYU
Executed: 2023-09-18
NA, WON JUN
Executed: 2023-09-18
KIM, DOO YOUNG
Executed: 2023-09-18
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component and Method of Manufacturing Multilayer Electronic Component