Patent Assignment
Reel/Frame 065171/0823
Assignment of Assignor's Interest
Recorded: 2023-10-10
Pages: 8
Assignors
KIM, KIKANG
Executed: 2021-04-15
KWON, HAKYONG
Executed: 2021-04-15
KIM, HIECHUL
Executed: 2021-04-15
KANG, SUNGKYU
Executed: 2021-04-15
LEE, SEUNGHWAN
Executed: 2021-04-15
KIM, SUNGBAE
Executed: 2021-04-15
AHN, JONGHYUN
Executed: 2021-04-01
KIM, SEONGRYEONG
Executed: 2021-04-15
KIM, KYUMIN
Executed: 2021-04-15
KIM, YOUNGMIN
Executed: 2021-04-15
Assignee
ASM IP HOLDING B.V.
VERSTERKERSTRAAT 8, ALMERE, 1322 AP, NETHERLANDS
Covered Property
(1)
Method for Filling a Gap in a Three-Dimensional Structure on a Semiconductor Substrate
Application:
18/378,403 →
Publication:
US 2024/0043997