Patent Assignment
Reel/Frame 065172/0784
Assignment of Assignor's Interest
Recorded: 2023-10-10
Pages: 7
Assignors
LIM, DONGWON
Executed: 2023-03-21
BAEK, INSEOK
Executed: 2023-03-21
AHN, SANGBIN
Executed: 2023-03-21
CHOI, SEOKYEONG
Executed: 2023-03-21
HONG, SEUNGYONG
Executed: 2023-03-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same
Application:
18/466,357 →
Publication:
US 2024/0107753