Patent Assignment
Reel/Frame 065176/0652
Assignment of Assignor's Interest
Recorded: 2023-10-11
Pages: 3
Assignee
SEMILEDS OPTOELECTRONICS CO., LTD.
3F, NO. 11, KE JUNG RD., CHU-NAN SITE, HSINCHU SCIENCE PARK, MIAO-LI COUNTY, CHU-NAN, 350, TAIWAN
Covered Property
(1)
Method For Making Electronic Device Arrays Using A Temporary Substrate