Patent Assignment
Reel/Frame 065182/0039
Assignment of Assignor's Interest
Recorded: 2023-10-11
Pages: 3
Assignee
HORIBA STEC, CO., LTD.
11-5, HOKOTATE-CHO, KAMITOBA, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8116, JAPAN
Covered Property
(1)
Wafer Temperature Control Device, Wafer Temperature Control Method, and Wafer Temperature Control Program