Patent Assignment
Reel/Frame 065199/0771
Assignment of Assignor's Interest
Recorded: 2023-10-12
Pages: 4
Assignor
CHOI, IMSU
Executed: 2023-10-10
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17084, KOREA, REPUBLIC OF
Covered Property
(1)
Automatic Wire Connection Apparatus for Circuit Board Testing
Application:
18/379,370 →
Publication:
US 2024/0329081