Patent Assignment
Reel/Frame 065206/0724
Assignment of Assignor's Interest
Recorded: 2023-10-13
Pages: 8
Assignors
IM, SEUNGWON
Executed: 2023-10-11
PARK, JEONGHYUK
Executed: 2023-10-11
LEE, KEUNHYUK
Executed: 2023-10-11
TEYSSEYRE, JEROME
Executed: 2023-10-13
BILARDO, PAOLO
Executed: 2023-10-11
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Power Module Package Having Mirrored Leads
Application:
18/485,966 →
Publication:
US 2024/0128140