Patent Assignment
Reel/Frame 065251/0193
Assignment of Assignor's Interest
Recorded: 2023-10-17
Pages: 3
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Systems and Methods for Direct Bonding in Semiconductor Die Manufacturing