Patent Assignment
Reel/Frame 065256/0364
Assignment of Assignor's Interest
Recorded: 2023-10-17
Pages: 5
Assignors
FAN, DONGYU
Executed: 2023-09-20
GAO, TINGTING
Executed: 2023-09-20
XIE, WEI
Executed: 2023-09-20
LV, ZHONG
Executed: 2023-09-25
XIA, ZHILIANG
Executed: 2023-10-12
HUO, ZONGLIANG
Executed: 2023-10-12
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, CHINA
Covered Property
(1)
Semiconductor Structure, Dicing Method Thereof, and Memory
Application:
18/381,030 →
Publication:
US 2024/0379578