Patent Assignment
Reel/Frame 065284/0243
Assignment of Assignor's Interest
Recorded: 2023-10-19
Pages: 3
Assignor
SHIH, SHING-YIH
Executed: 2021-08-17
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Semiconductor Package Structure Having Multiple Bonding Pads