Patent Assignment
Reel/Frame 065289/0876
Assignment of Assignor's Interest
Recorded: 2023-10-20
Pages: 3
Assignor
MAE, RYOTA
Executed: 2023-10-10
Assignee
FUJIMI INCORPORATED
1-1, CHIRYO 2-CHOME, NISHIBIWAJIMA-CHO, KIYOSU-SHI, AICHI, 4528502, JAPAN
Covered Property
(1)
Polishing Composition, Production Method of Polishing Composition, Polishing Method, and Manufacturing Method of Semiconductor Substrate
Application:
18/370,486 →
Publication:
US 2024/0101866