Assignment of Assignor's Interest

Recorded: 2023-10-23 Pages: 2

Assignor

HAMADA, DAISUKE

Executed: 2023-09-13

Assignee

TOPPAN INC.

5-1, TAITO 1-CHOME, TAITO-KU, TOKYO, 110-0016, JAPAN

Covered Property (1)

Multilayer Film, Packaging Material, and Package

Application: 18/556,780 →

Publication: US 2024/0198642

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.